Gencoa plasma sources
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GENCOA -  PLASMA SOURCES

Gencoa provide a range of plasma source technology based upon DC, AC and HIPIMS power modes, and for applications including pre-cleaning, coating removal and ion beam deposition.

Linear and circular ion sources for a range of applications

Linear and circular ion sources for a range of applications Gencoa offer ion sources in both linear and circular sizes, and suitable for a range of applications. Both the linear ion source and the compact IMC75 circular ion source can be matched with an associated power supply offering improved control and automatic gas regulation.

Ion sources offer a robust and flexible means of modifying or pre-cleaning large area polymer and glass substrates prior to thin film deposition. Based on the inverted magnetron principle, the sources produce a collimated plasma beam that lightly etch the substrate, burning off hydrocarbons and activating the surface to promote adhesion of the deposited film. Unlike conventional technology, Gencoa's ion sources are assembled with a graphite anode and cathode, protecting the substrate from contamination and preventing erosion of source. The sources are indirectly cooled, minimizing source maintenance and are available from 20-500 cm in length. Typical operation involves using DC power supply, with other power modes - such as pulsed DC - also suitable

 
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circular ion source

LINEAR ION SOURCE

Linear ion sources by Gencoa are a robust and flexible means of pre-cleaning polymer and glass substrates prior to thin film deposition. The plasma jets generated impact the substrate to burn-off hydrocarbons and activate the surface to promote adhesion of the deposited film.

Key features

  • Optimized magnetic fields to produce a collimated plasma beam at standard sputtering pressures

  • Automated regulation for the gas to maintain constant current & voltage - multi-gas auto control

  • Graphite anode and cathode to protect the substrate from contamination and provide long-life components

  • RF standard electrical insulation on all ion sources

  • In-direct cooling of anode and cathode - quick switching of parts

  • Easy switching of cathode parts to provide multiple magnetic traps for lower voltage operation, or a focused beam

  • Voltage regulated power supply with gas adjustment feedback to maintain the same current at all times

CIRCULAR ION SOURCE

Gencoa's IMC75 is a gridless and self-neutralizing circular ion source, and marks a new generation in ion etching.

Key features

  • Inversed magnetron ion beam

  • Self neutralized ion beam

  • Operating pressure in large pressure range (E-4 to E-3 mbar)

  • Tilting head - ion angle control

  • Stable ion beam current and ion energy distribution

  • Feedback control

  • Variety of gas feed possible

  • No contamination

  • Suitable for semiconductor industry

 

 

IMC75 Ion Etching Applications

  • Nanotexturing

  • Coating removal

  • Improving coating adhesion

  • ITO and silver deposition assistance

  • PACVD - DLC deposition

  • Ion beam deposition

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oxygen-plasma-source

PLASMA TREATER

Gencoa offer a range of plasma based pre-treatment and etching devices for a variety of applications.

The devices are split into different power modes and magnetic designs:

High voltage (> + 1kV) DC low current inverted magnetron type ion sources

DC magnetron based plasma pre-treatment - magnetron devices for high power pre-treatment of plastic web

AC type dual cathode type plasma pre-treaters for plastic web pre-treatment

Positive DC and Pulsed DC based inverted magnetron substrate ion etchers for metallic web substrates

AC type PECVD sources are available for various CVD depositions

HipV + positive high current pulse type pre-treatment for all material types

RF power

ACTIVATED OXYGEN PLASMA SOURCE

Gencoa's high power gas plasma source is a new solution for pre-treatment and radical assisted sputtering which delivers key benefits over traditional RF and microwave powered gas sources.

The gas source delivers a high current density for substrate treatment, and can be assembled with source lengths of up to 4m without any power scaling issues.

Power is switched between two water-cooled electrodes in the presence of oxygen gas and a magnetic field. The resulting plasma ionizes the oxygen gas species and also provides an electron shower for neutralization which avoids charge build-up on the substrates.

The double electrode switches from positive to negative and delivers a stable and highly uniform plasma.

Shields are water cooled for low temperature processing, and the sources operate without coating or debris, which therefore eliminates any requirement for cleaning.

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